Which Compound to Use to Manufacture a Telecommunication Equipment Part
Application photo pending
NEXXALAC™
Unfilled PC/ABS Compound
View compound →
What Is It?
NEXXALAC™ Unfilled PC/ABS Compound, chosen for telecom equipment needing both surface finish and moderate heat tolerance.
How It's Manufactured
PC and ABS resins are melt-blended on a twin-screw line for a balanced processing window between the two base resins.
Manufacturing Process for This Application
Telecom equipment housings are injection molded from the blend, using its good flow to fill enclosures with multiple port and connector cutouts.
Why Polymer Choice Matters Here
Telecom equipment often runs continuously in equipment cabinets or outdoor cabinets with limited ventilation, generating sustained low-level heat — PC/ABS's heat resistance over plain ABS is why it is preferred for equipment expected to run 24/7.
Why This Compound Is Suited
"Tele communication parts" is explicitly listed among this grade's applications.
Nexxa Compounds is a leading manufacturer of PC/ABS compounds for telecommunication part applications in India, supplying some of the largest manufacturers across India and internationally.
Related Posts
Which Compound to Use to Manufacture a PC/ABS Mobile Housing
Why PC/ABS blends are chosen over pure ABS or pure PC for mobile phone and telecom equipment housings.
Which Compound to Use to Manufacture a Mobile Charger Casing
Why flame retardant PC/ABS is required for mobile charger housings that enclose live mains-voltage circuitry.
Which Compound to Use to Manufacture a PC/ABS Automotive Interior Part
Why unfilled PC/ABS is used for automotive interior trim needing both impact strength and heat resistance.